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Standard JIS C5630-18:2014 22.12.2014 preview

JIS C5630-18:2014

Semiconductor devices -- Micro-electromechanical devices -- Part 18: Bend testing methods of thin film materials

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STANDARD published on 22.12.2014


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The information about the standard:

Designation standards: JIS C5630-18:2014
Publication date standards: 22.12.2014
SKU: NS-1075554
The number of pages: 12
Approximate weight : 36 g (0.08 lbs)
Country: Japanese technical standard
Category: Technical standards JIS

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