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Environmental testing -- Part 2-83: Tests -- Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste
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STANDARD published on 22.9.2014
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Designation standards: JIS C60068-2-83:2014
Publication date standards: 22.9.2014
SKU: NS-1075726
The number of pages: 40
Approximate weight : 120 g (0.26 lbs)
Country: Japanese technical standard
Category: Technical standards JIS
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