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Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste (german version)
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STANDARD published on 1.6.2026
Designation standards: ÖVE EN IEC 60068-2-83
Publication date standards: 1.6.2026
SKU: NS-1271811
The number of pages: 36
Approximate weight : 108 g (0.24 lbs)
Country: Austrian technische Norm
Category: Technical standards ÖNORM
Dieser Teil von IEC 60068 beinhaltet Verfahren zur vergleichenden Bestimmung der Benetzbarkeit metallischer oder metallisierter Anschlüsse von SMD mittels Lotpasten. Die mit diesem Verfahren erhaltenen Daten sind nicht als absolute quantitative Daten für Bestanden/Nicht- Bestanden-Zwecke vorgesehen.
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