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Standard ÖVE EN IEC 61189-3-302 1.9.2026 preview

ÖVE EN IEC 61189-3-302

Test methods for electrical materials, printed boards and other interconnection structures and assemblies -- Part 3-302: Detection of plating defects in unpopulated circuit boards by computed tomography (CT) (( IEC 61189-3-302:2025) EN IEC 61189-3-302:2025) (german version)

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STANDARD published on 1.9.2026


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The information about the standard:

Designation standards: ÖVE EN IEC 61189-3-302
Publication date standards: 1.9.2026
SKU: NS-1283329
The number of pages: 22
Approximate weight : 66 g (0.15 lbs)
Country: Austrian technische Norm
Category: Technical standards ÖNORM

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Printed circuits and boards

Annotation of standard text ÖVE EN IEC 61189-3-302 :

In diesem Teil von IEC 61189 wird ein Verfahren zur Erkennung von Beschichtungsfehlern in unbestückten Leiterplatten durch Computertomographie (CT) beschrieben.

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