Standard ÖVE EN IEC 62878-2-603 1.8.2026 preview

ÖVE EN IEC 62878-2-603

Device embedding assembly technology -- Part 2-603: Guideline for stacked electronic module - Test method of intra-module electrical connectivity ((IEC 62878-2-603:2025) EN IEC 62878-2-603:2025) (german version)

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STANDARD published on 1.8.2026


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The information about the standard:

Designation standards: ÖVE EN IEC 62878-2-603
Publication date standards: 1.8.2026
SKU: NS-1279337
The number of pages: 16
Approximate weight : 48 g (0.11 lbs)
Country: Austrian technische Norm
Category: Technical standards ÖNORM

Annotation of standard text ÖVE EN IEC 62878-2-603 :

Dieser Teil von IEC 62878 legt das elektrische Prüfverfahren zur Erkennung von elektrischen Verbindungsfehlern des gestapelten Elektronikmoduls fest, die durch den Stapelmontageprozess zum Stapeln mehrerer stapelbarer Elektronikmodule verursacht werden. Dieses Verfahren wird zur Nutzung der bidirektionalen seriellen Kommunikationsschnittstelle bei stapelbaren Elektronikmodulen eingesetzt, die als "Known Good Module" (als gut klassifiziertes Modul, KGM) gelten.

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