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Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
Automatically translated name:
Environmental testing. Part 2-58 : Tests. Test Td. Test methods for solderability , resistance to dissolution plating and heat resistance of soldering surface mount components (SMD) (IEC STN ).
STANDARD published on 1.10.2015
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Designation standards: STN EN 60068-2-58
Classification mark: 345791
Catalog number: 121580
Publication date standards: 1.10.2015
SKU: NS-616294
Approximate weight : 48 g (0.11 lbs)
Country: Slovak technical standard
Category: Technical standards STN
Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
Change published on 1.2.2019
Selected format: WITHDRAWN
1.6.2002
1.12.2010
WITHDRAWN
1.9.2007
1.12.2013
WITHDRAWN
1.8.2001
1.12.2013
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