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Mechanical standardization of semiconductor devices. Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Measuring methods for package dimensions of quad flat packs (QFP)
STANDARD published on 1.4.2002
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Designation standards: STN EN 60191-6-3
Classification mark: 358791
Catalog number: 85951
Publication date standards: 1.4.2002
SKU: NS-525869
Approximate weight : 300 g (0.66 lbs)
Country: Slovak technical standard
Category: Technical standards STN
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