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Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-4: General test methods for materials and assemblies - Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies
Automatically translated name:
Test methods for electrical materials, printed boards and other interconnection structures and assemblies. Part 5-4: General test methods for materials and assemblies. Solder and wire electrodes for printed circuit boards (IEC STN ).
STANDARD published on 1.8.2015
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Designation standards: STN EN 61189-5-4
Classification mark: 346513
Catalog number: 121092
Publication date standards: 1.8.2015
SKU: NS-612285
Approximate weight : 30 g (0.07 lbs)
Country: Slovak technical standard
Category: Technical standards STN
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