We need your consent to use the individual data so that you can see information about your interests, among other things. Click "OK" to give your consent.
Thermal standardization on semiconductor packages - Part 3: Thermal circuit simulation models of discrete semiconductor packages for transient analysis
Translate name
STANDARD published on 1.11.2025
| Language | |
| Format |
|
| Availability | The sale has ended |
| Price | ONREQUEST excl. VAT |
| ON REQUEST |
Designation standards: STN EN IEC 63378-3
Classification mark: 358790
Catalog number: 141239
Publication date standards: 1.11.2025
SKU: NS-1246950
Approximate weight : 30 g (0.07 lbs)
Country: Slovak technical standard
Category: Technical standards STN
Do you want to be sure about the validity of used regulations?
We offer you a solution so that you could use valid and updated legislative regulations.
Would you like to get more information? Look at this page.
Latest update: 2026-10-02 (Number of items: 2 304 304)
© Copyright 2026 NORMSERVIS s.r.o.