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Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices
Automatically translated name:
SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS -- PART 15: RESISTANCE TO SOLDERING TEMPERATURE FOR THROUGH-HOLE MOUNTED DEVICES
STANDARD published on 13.7.2011
Designation standards: UNE-EN 60749-15:2011
Note: WITHDRAWN
Publication date standards: 13.7.2011
SKU: NS-560991
The number of pages: 23
Approximate weight : 69 g (0.15 lbs)
Country: Spanish technical standard
Category: Technical standards UNE
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