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  4. Standard "UNE-EN 60749-19:2003/A1:2011"
Change UNE-EN 60749-19:2003/A1:2011 19.1.2011 preview

UNE-EN 60749-19:2003/A1:2011

Semiconductor devices - Mechanical and climatic test methods -- Part 19: Die shear strength

Automatically translated name:

SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS -- PART 19: DIE SHEAR STRENGTH



STANDARD published on 19.1.2011


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36.50 USD

The information about the standard:

Designation standards: UNE-EN 60749-19:2003/A1:2011
Note: Change
Publication date standards: 19.1.2011
SKU: NS-560995
The number of pages: 12
Approximate weight : 36 g (0.08 lbs)
Country: Spanish technical standard
Category: Technical standards UNE

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Semiconductor devices in general

This change (correction) applies to this standard:

Preview UNE-EN 60749-19:2003 21.11.2003
UNE-EN 60749-19:2003

Semiconductor devices - Mechanical and climatic test methods -- Part 19: Die shear strength

Standard published on 21.11.2003

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