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Standard UNE-EN IEC 60749-22-2:2026 1.2.2026 preview

UNE-EN IEC 60749-22-2:2026

Semiconductor devices - Mechanical and climatic test methods - Part 22-2: Bond strength - Wire bond shear test methods (Endorsed by Asociación Espanola de Normalización in February of 2026.)

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STANDARD published on 1.2.2026


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The information about the standard:

Designation standards: UNE-EN IEC 60749-22-2:2026
Publication date standards: 1.2.2026
SKU: NS-1260643
The number of pages: 43
Approximate weight : 129 g (0.28 lbs)
Country: Spanish technical standard
Category: Technical standards UNE

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