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BSi – The company, BSI British Standards, is a national standards body of the United Kingdom (NBS) and it was actually the very first one in the world. It represents national and social interests of Great Britain in all European and international standardization organizations and in the development of business information of British institutions of all sizes and sectors. BSI British Standards cooperates with manufacturing and service industries, various companies, the government and with consumers as well in order to facilitate the production of British, European and international standards. A part of BSI Group, BSI British Standards, works closely with the government of the United Kingdom, especially in the Department for Innovations, Universities and Skills (DIUS).
Discrete semiconductor devices and integrated circuits. Field-effect transistors. Additional ratings and characteristics and amds in the measuring methods for power switching field effect transistors..
WITHDRAWN published on 15.6.2001
Selected format:Semiconductor devices. Discrete devices. Insulated-gate bipolar transistors (IGBTs).
WITHDRAWN published on 17.1.2003
Selected format:Semiconductor devices. Discrete devices. Insulated-gate bipolar transistors (IGBTs).
WITHDRAWN published on 30.11.2007
Selected format:Semiconductor devices. Integrated circuits. Digital integrated circuits. Family specification. Low voltage integrated circuits.
WITHDRAWN published on 15.4.2001
Selected format:Semiconductor devices. Mechanical and climatic test methods. Mechanical shock.
WITHDRAWN published on 17.9.2002
Selected format:Semiconductor devices. Mechanical and climatic test methods. Vibration, variable frequency.
WITHDRAWN published on 10.9.2002
Selected format:Semiconductor devices. Mechanical and climatic test methods. Salt atmosphere.
WITHDRAWN published on 17.9.2002
Selected format:Semiconductor devices. Mechanical and climatic test methods. Resistance to soldering temperature for through-hole mounted devices.
WITHDRAWN published on 19.6.2003
Selected format:Semiconductor devices. Mechanical and climatic test methods. Resistance to soldering temperature for through-hole mounted devices.
WITHDRAWN published on 30.6.2011
Selected format:Semiconductor devices. Mechanical and climatic test methods. Neutron irradiation.
WITHDRAWN published on 29.6.2004
Selected format:Latest update: 2025-12-18 (Number of items: 2 252 678)
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