Directives for drafting semiconductor facilities interface specification

Standard published on 22.12.1995

General specification for trunked mobile communication system

Standard published on 22.12.1995

General specification for leaky cable radiocommunication system

Standard published on 22.12.1995

Semiconductor integrated circuits—Specification of leadframes for plastic quad flat package

Standard published on 15.5.2015

Semiconductor integrated circuits—Specification of DIP leadframes produced by etching

Standard published on 31.12.2013

Semiconductor integrated circuits—Specification of leadframes for small outline package

Standard published on 15.5.2015

Mechanical standardization of semiconductor devices—Part 4: Coding system and classification into forms of package outlines for semiconductor device packages

Standard published on 30.8.2019

Mechanical standardization of semiconductor devices—Part 5: Recommendations applying to tape automated bonding(TAB) of integrated circuits

Standard published on 17.9.2018

Mechanical standardization of semiconductor devices—Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages—Measuring methods for package dimensions of ball grid array (BGA)

Standard published on 23.5.2023

Mechanical standardization of semiconductor devices—Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages—Design guidelines for fine-pitch land grid array (FLGA)

Standard published on 31.12.2025