Mechanical standardization of semiconductor devices—Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA)
Execute Date: march 2027

Standard published on 28.8.2026

Mechanical standardization of semiconductor devices—Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA
Execute Date: march 2027

Standard published on 28.8.2026

Mechanical standardization of semiconductor devices—Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages—Design guide for ball grid array (BGA)
Execute Date: february 2027

Standard published on 30.7.2026

Mechanical standardization of semiconductor devices—Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages—Measuring methods for package dimensions of small outline J-lead packages SOJ
Execute Date: february 2027

Standard published on 30.7.2026

Medical glass thermometer

Standard published on 29.4.2024

Potentiometers for use in electronic equipment--Part 3:Sectional specification--Rotary precision potentiometers

Standard published on 22.12.1995

Potentiometers for use in electronic equipment--Part 3:Blank detail specification--Rotary precision potentiometers--Assessment level E

Standard published on 22.12.1995

R.F. coaxial connectors type C

Standard published on 22.12.1995

R.F. coaxial connectors type UHF

Standard published on 22.12.1995

Limits of dimensions, axle load and masses for motor vehicles,trailers and combination vehicles

Standard published on 26.7.2016