Cookies
We need your consent to use the individual data so that you can see information about your interests, among other things. Click "OK" to give your consent.
Standards GB - Chinese national standards - Page 4187
Standards GB are Chinese national standards, which are issued by China's Standardization Administration Office (SAC).
Chinese national standards are used all over China commonly labeled as GB standards. They determine the united production requirements regarding product safety and quality .
GB standards are often modified or created according to the international standards of ISO, IEC or any other international level.
Although, they are largely harmonized, GB standards may differ from international standards .
Approximately 15% of all GB standards are obligatory and they can be identified according to the prefix GB, after which the code of the standards follows:
GB – Obligatory national standards
GB/T – Optional national standards
GB/Z – National steering technical document
Price display: excl. VAT
Displayed currency:
USD
Sort by:
GB/T 42709.12-2026
Show all technical information.
Semiconductor devices—Micro-electromechanical devices—Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures
Execute Date: february 2027
Standard published on 30.7.2026
Selected format:Show all technical information.
GB/T 42709.19-2023
Show all technical information.
Semiconductor devices—Micro-electromechanical devices—Part 19: Electronic compasses
Standard published on 6.8.2023
Selected format:Show all technical information.
GB/T 42709.2-2026
Show all technical information.
Semiconductor devices—Micro-electromechanical devices—Part 2: Tensile testing method of thin film materials
Execute Date: november 2026
Standard published on 30.4.2026
Selected format:Show all technical information.
GB/T 42709.21-2026
Show all technical information.
Semiconductor devices—Micro-electromechanical devices—Part 21: Test method for Poisson""s ratio of thin film MEMS materials
Execute Date: february 2027
Standard published on 30.7.2026
Selected format:Show all technical information.
GB/T 42709.22-2026
Show all technical information.
Semiconductor devices—Micro-electromechanical devices—Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates
Execute Date: february 2027
Standard published on 30.7.2026
Selected format:Show all technical information.
GB/T 42709.29-2026
Show all technical information.
Semiconductor devices—Micro-electromechanical devices—Part 29: Electromechanical relaxation test method for freestanding conductive thin films under room temperature
Execute Date: march 2027
Standard published on 28.8.2026
Selected format:Show all technical information.
GB/T 42709.3-2026
Show all technical information.
Semiconductor devices—Micro-electromechanical devices—Part 3: Thin film standard test piece for tensile testing
Execute Date: november 2026
Standard published on 30.4.2026
Selected format:Show all technical information.
GB/T 42709.35-2026
Show all technical information.
Semiconductor devices—Micro-electromechanical devices—Part 35: Test method of electrical characteristics under bending deformation for flexible electro-mechanical devices
Execute Date: february 2027
Standard published on 30.7.2026
Selected format:Show all technical information.
GB/T 42709.36-2026
Show all technical information.
Semiconductor devices—Micro-electromechanical devices—Part 36: Environmental and dielectric withstand test methods for MEMS piezoelectric thin films
Execute Date: february 2027
Standard published on 30.7.2026
Selected format:Show all technical information.
GB/T 42709.38-2026
Show all technical information.
Semiconductor devices—Micro-electromechanical devices—Part 38: Test method for adhesion strength of metal powder paste in MEMS interconnection
Execute Date: february 2027
Standard published on 30.7.2026
Selected format:Show all technical information.
Can we help you with something?
