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DIN - German national standards - Page 17410

Standards DIN - German national standards - Page 17410

DIN is a protected designation of German national technical standards.

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Preview DIN CLC/TS 62046:2005-09 1.9.2005
DIN CLC/TS 62046:2005-09 WITHDRAWN

VDE V 0113-211. Safety of machinery - Application of protective equipment to detect the presence of persons.
(VDE V 0113-211. Sicherheit von Maschinen - Anwendung von Schutzausrüstungen zur Anwesenheitserkennung von Personen.)

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Preview E DIN IEC 62046:2006-08 1.8.2006
E DIN IEC 62046:2006-08 WITHDRAWN

VDE 0113-211. Safety of machinery - Application of protective equipment to detect the presence of persons.
(VDE 0113-211. Sicherheit von Maschinen - Anwendung von Schutzeinrichtungen zum Erkennen von Personen.)

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Preview DIN CLC/TS 62046:2009-04 1.4.2009
DIN CLC/TS 62046:2009-04 WITHDRAWN

VDE V 0113-211. Safety of machinery - Application of protective equipment to detect the presence of persons.
(VDE V 0113-211. Sicherheit von Maschinen - Anwendung von Schutzausrüstungen zur Anwesenheitserkennung von Personen.)

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Preview E DIN EN 62046:2013-04 1.4.2013
E DIN EN 62046:2013-04 WITHDRAWN

VDE 0113-211. Safety of machinery - Application of protective equipment to detect the presence of persons.
(VDE 0113-211. Sicherheit von Maschinen - Anwendungen von Schutzausrüstungen zur Anwesenheitserkennung von Personen.)

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Preview E DIN IEC 62047-1:2003-10 1.10.2003
E DIN IEC 62047-1:2003-10 WITHDRAWN

Semiconductor devices - Part 1: Microelectromechanical devices; Terms and definitions.
(Halbleiterbauelemente - Teil 1: Bauteile der Mikrosystemtechnik; Begriffe und Definitionen.)

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Preview DIN EN 62047-1:2006-10 1.10.2006
DIN EN 62047-1:2006-10 WITHDRAWN

Semiconductor devices - Micro-electromechanical devices - Part 1: Terms and definitions.
(Halbleiterbauelemente - Bauteile der Mikrosystemtechnik - Teil 1: Begriffe und Definitionen.)

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Preview E DIN EN 62047-1:2014-05 1.5.2014
E DIN EN 62047-1:2014-05 WITHDRAWN

Semiconductor devices - Micro-electromechanical devices - Part 1: Terms and definitions.
(Halbleiterbauelemente - Bauelemente der Mikrosystemtechnik - Teil 1: Begriffe.)

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Preview E DIN IEC 62047-10:2010-05 1.5.2010
E DIN IEC 62047-10:2010-05 WITHDRAWN

Semiconductor devices - Micro-electromechanical devices - Part 10: Micropillar compression test for MEMS materials.
(Halbleiterbauelemente - Bauelemente der Mikrosystemtechnik - Teil 10: Druckprüfverfahren an zylinderförmigen Mikroproben für Werkstoffe der Mikrosystemtechnik.)

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Preview E DIN IEC 62047-11:2010-06 1.6.2010
E DIN IEC 62047-11:2010-06 WITHDRAWN

Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for linear thermal expansion coefficients of MEMS materials.
(Halbleiterbauelemente - Bauelemente der Mikrosystemtechnik - Teil 11: Prüfverfahren für lineare thermische Ausdehnungskoeffizienten für Werkstoffe der Mikrosystemtechnik.)

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Preview E DIN IEC 62047-12:2010-05 1.5.2010
E DIN IEC 62047-12:2010-05 WITHDRAWN

Semiconductor devices - Micro-electromechanical devices - Part 12: A method for fatigue testing thin film materials using the resonant vibration of a MEMS structure.
(Halbleiterbauelemente - Bauelemente der Mikrosystemtechnik - Teil 12: Verfahren zur Prüfung der Ermüdungsfestigkeit von Dünnschichtwerkstoffen unter Verwendung der Resonanzschwingungen bei MEMS-Strukturen.)

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