Device embedding assembly technology - Part 2-7: Guidelines - Accelerated stress testing of passive embedded circuit boards

Standard published on 20.3.2019

Device embedding assembly technology - Part 2-8: Guidelines - Warpage control of active device embedded substrate

Standard published on 7.7.2021

Device embedding assembly technology - Part 2-9: Guidelines - Concept of JISSO level in the electronic assembly technology industries

Standard published on 27.4.2022

Semiconductor devices - Stress migration test standard - Part 1: Copper stress migration test standard

Standard published on 23.8.2017

Cause and effect matrix
(Matrice des causes et effets)

Standard published on 10.10.2018

Corrigendum 1 - Cause and effect matrix
(Corrigendum 1 - Matrice des causes et effets)

Correction published on 23.4.2019

Hydraulic machines - Francis turbine pressure fluctuation transposition

Standard published on 18.9.2020

Measurement techniques of piezoelectric, dielectric and electrostatic oscillators - Part 1: Basic methods for the measurement
(Techniques de mesure des oscillateurs piezoelectriques, dielectriques et electrostatiques - Partie 1: Methodes fondamentales pour le mesurage)

Standard published on 8.6.2017

Measurement techniques of piezoelectric, dielectric and electrostatic oscillators - Part 2: Phase jitter measurement method
(Techniques de mesure des oscillateurs piezoelectriques, dielectriques et electrostatiques - Partie 2 : Methode de mesure de la gigue de phase)

Standard published on 30.8.2017

Measurement techniques of piezoelectric, dielectric and electrostatic oscillators - Part 3: Frequency aging test methods
(Techniques de mesure des oscillateurs piezoelectriques, dielectriques et electrostatiques - Partie 3: Methode d’essai du vieillissement en frequence)

Standard published on 22.3.2018