Semiconductor devices. Integrated circuits. Part 20: Generic specification for film integrated circuits and hybrid film integrated circuits
(Dispositifs a semiconducteurs. Circuits integres. Vingtieme partie: Specification generique pour les circuits integres a couches et les circuits integres hybrides a couches)

Standard published on 30.6.1988

Amendment 1 - Semiconductor devices. Integrated circuits. Part 20: Generic specification for film integrated circuits and hybrid film integrated circuits
(Amendement 1 - Dispositifs a semiconducteurs. Circuits integres. Vingtieme partie: Specification generique pour les circuits integres a couches et les circuits integres hybrides a couches)

Change published on 22.9.1995

Semiconductor devices - Integrated circuits - Part 21-1: Blank detail specification for film integrated circuits and hybrid film integrated circuits on the basis of qualification approva lprocedures
(Dispositifs a semiconducteurs - Circuits integres - Partie 21-1:Specification particuliere cadre pour les circuits integres a couches et les circuits integres hybrides a couches sur la base des procedures d´homologation)

Standard published on 10.4.1997

Semiconductor devices - Integrated circuits - Part 21: Sectional specification for film integrated circuits and hybrid film integrated circuits on the basis of qualification approval procedures
(Dispositifs a semiconducteurs - Circuits integres - Partie 21:Specification intermediaire pour les circuits integres a couches et les circuits integres hybrides a couches sur la base des procedures d´homologation)

Standard published on 10.4.1997

Semiconductor devices - Integrated circuits - Part 22-1: Blank detail specification for film integrated circuits and hybrid film integrated circuits on the basis of the capability approval procedures
(Dispositifs a semiconducteurs - Circuits integres - Partie 22-1: Specification particuliere cadre pour les circuits integres a couches et les circuits integres hybrides a couches sur la base des procedures d´agrement de savoir-faire)

Standard published on 10.4.1997

Semiconductor devices - Integrated circuits - Part 22: Sectional specification for film integrated circuits and hybrid film integrated circuits on the basis of the capability approval procedures
(Dispositifs a semiconducteurs - Circuits integres - Partie 22: Specification intermediaire pour les circuits integres a couches et les circuits integres hybrides a couches sur la base des procedures d´agrement de savoir-faire)

Standard published on 10.4.1997

Semiconductor devices - Integrated circuits - Part 23-1: Hybrid integrated circuits and film structures - Manufacturing line certification - Generic specification

Standard published on 15.5.2002

Semiconductor devices - Integrated circuits - Part 23-2: Hybrid integrated circuits and film structures - Manufacturing line certification - Internal visual inspection and special tests

Standard published on 23.5.2002

Semiconductor devices - Integrated circuits - Part 23-3: Hybrid integrated circuits and film structures - Manufacturing line certification - Manufacturers´ self-audit checklist and report

Standard published on 17.5.2002

Semiconductor devices - Integrated circuits - Part 23-4: Hybrid integrated circuits and film structures - Manufacturing line certification - Blank detail specification

Standard published on 17.5.2002