We need your consent to use the individual data so that you can see information about your interests, among other things. Click "OK" to give your consent.
Semiconductor devices - Integrated circuits - Part 2: Digital integrated circuits
(Dispositifs a semiconducteurs - Circuits integres - Partie 2: Circuits integres numeriques)
Standard published on 22.12.1997
Selected format:
Semiconductor devices - Integrated circuits - Part 20: Generic specification for film integrated circuits and hybrid film integrated circuits - Section 1: Requirements for internal visual examination
(Dispositifs a semiconducteurs - Circuits integres - Partie 20: Specification generique pour les circuits integres a couches et les circuits integres hybrides a couches - Section 1: Exigences pour l´examen visuel interne)
Standard published on 1.3.1994
Selected format:
Semiconductor devices. Integrated circuits. Part 20: Generic specification for film integrated circuits and hybrid film integrated circuits
(Dispositifs a semiconducteurs. Circuits integres. Vingtieme partie: Specification generique pour les circuits integres a couches et les circuits integres hybrides a couches)
Standard published on 30.6.1988
Selected format:
Amendment 1 - Semiconductor devices. Integrated circuits. Part 20: Generic specification for film integrated circuits and hybrid film integrated circuits
(Amendement 1 - Dispositifs a semiconducteurs. Circuits integres. Vingtieme partie: Specification generique pour les circuits integres a couches et les circuits integres hybrides a couches)
Change published on 22.9.1995
Selected format:
Semiconductor devices - Integrated circuits - Part 21-1: Blank detail specification for film integrated circuits and hybrid film integrated circuits on the basis of qualification approva lprocedures
(Dispositifs a semiconducteurs - Circuits integres - Partie 21-1:Specification particuliere cadre pour les circuits integres a couches et les circuits integres hybrides a couches sur la base des procedures d´homologation)
Standard published on 10.4.1997
Selected format:
Semiconductor devices - Integrated circuits - Part 21: Sectional specification for film integrated circuits and hybrid film integrated circuits on the basis of qualification approval procedures
(Dispositifs a semiconducteurs - Circuits integres - Partie 21:Specification intermediaire pour les circuits integres a couches et les circuits integres hybrides a couches sur la base des procedures d´homologation)
Standard published on 10.4.1997
Selected format:
Semiconductor devices - Integrated circuits - Part 22-1: Blank detail specification for film integrated circuits and hybrid film integrated circuits on the basis of the capability approval procedures
(Dispositifs a semiconducteurs - Circuits integres - Partie 22-1: Specification particuliere cadre pour les circuits integres a couches et les circuits integres hybrides a couches sur la base des procedures d´agrement de savoir-faire)
Standard published on 10.4.1997
Selected format:
Semiconductor devices - Integrated circuits - Part 22: Sectional specification for film integrated circuits and hybrid film integrated circuits on the basis of the capability approval procedures
(Dispositifs a semiconducteurs - Circuits integres - Partie 22: Specification intermediaire pour les circuits integres a couches et les circuits integres hybrides a couches sur la base des procedures d´agrement de savoir-faire)
Standard published on 10.4.1997
Selected format:Semiconductor devices - Integrated circuits - Part 23-1: Hybrid integrated circuits and film structures - Manufacturing line certification - Generic specification
Standard published on 15.5.2002
Selected format:Semiconductor devices - Integrated circuits - Part 23-2: Hybrid integrated circuits and film structures - Manufacturing line certification - Internal visual inspection and special tests
Standard published on 23.5.2002
Selected format:Latest update: 2026-07-10 (Number of items: 2 286 359)
© Copyright 2026 NORMSERVIS s.r.o.