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Corrigendum 1 - Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
Correction published on 16.9.2019
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Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
(Ensembles de cartes imprimees - Partie 3: Specification intermediaire - Exigences relatives a l´assemblage par brasage de trous traversants)
Standard published on 30.5.2017
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Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies
(Ensembles de cartes imprimees – Partie 4: Specification intermediaire – Exigences relatives a l’assemblage de bornes par brasage)
Standard published on 26.7.2017
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Printed board assemblies - Part 6: Evaluation criteria for voids in soldered joints of BGA and LGA and measurement method
(Ensembles de cartes imprimees - Partie 6: Criteres d´evaluation des vides dans les joints brases des boitiers BGA et LGA et methode de mesure)
Standard published on 14.1.2010
Selected format:Printed board assemblies - Part 7: Technical cleanliness of components and printed board assemblies
Standard published on 11.3.2020
Selected format:Printed board assemblies - Part 8: Voiding in solder joints of printed board assemblies for use in automotive electronic control units - Best practices
Standard published on 19.3.2021
Selected format:Printed board assemblies - Part 9: Electrochemical reliability and ionic contamination on printed circuit board assemblies for use in automotive applications - Best practices
Standard published on 7.6.2023
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Quality assessment systems - Part 1: Registration and analysis of defects on printed board assemblies
(Systeme d´assurance de la qualite - Partie 1: Enregistrement et analyse des defauts sur les cartes imprimees equipees)
Standard published on 19.12.2001
Selected format:Quality assessment systems - Part 2: Selection and use of sampling plans for inspection of electronic components and packages
Standard published on 30.8.2007
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Quality assessment systems - Part 3: Selection and use of sampling plans for printed board and laminate end-product and in-process auditing
(Systeme d´assurance de la qualite - Partie 3: Choix et utilisation de plans d´echantillonnage pour cartes imprimees et produits finis stratifies et audits en cours de fabrication)
Standard published on 24.1.2013
Selected format:Latest update: 2026-07-02 (Number of items: 2 285 873)
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