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Standards IEC - International electro-technical commission - Page 577
IEC – The company IEC is world-leading organization, which creates and issues International standards for all electrical, electronic and other related technologies known generally as electro-technologies. Wherever, there is electricity and electronics you can find the company IEC, which promotes the safety and performance, the environment, electrical energy efficiency and renewable energy. The company IEC also administers conformity assessment systems, which certify that the equipment, systems or components comply with International Standards of this company.
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IEC 61191-1-ed.3.0-RLV
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Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
Standard published on 14.9.2018
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IEC/PAS 61191-10-ed.1.0
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Printed board assemblies - Part 10: Application and utilization of protective coatings for electronic assemblies
Standard published on 18.7.2022
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IEC 61191-2-ed.3.0
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Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
(Ensembles de cartes imprimees - Partie 2: Specification intermediaire - Exigences relatives a l´assemblage par brasage pour montage en surface)
Standard published on 23.5.2017
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IEC 61191-2-ed.3.0/Cor.1
Correction
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Corrigendum 1 - Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
Correction published on 16.9.2019
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IEC 61191-3-ed.2.0
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Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
(Ensembles de cartes imprimees - Partie 3: Specification intermediaire - Exigences relatives a l´assemblage par brasage de trous traversants)
Standard published on 30.5.2017
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IEC 61191-4-ed.2.0
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Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies
(Ensembles de cartes imprimees – Partie 4: Specification intermediaire – Exigences relatives a l’assemblage de bornes par brasage)
Standard published on 26.7.2017
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IEC 61191-6-ed.1.0
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Printed board assemblies - Part 6: Evaluation criteria for voids in soldered joints of BGA and LGA and measurement method
(Ensembles de cartes imprimees - Partie 6: Criteres d´evaluation des vides dans les joints brases des boitiers BGA et LGA et methode de mesure)
Standard published on 14.1.2010
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IEC/TR 61191-7-ed.1.0
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Printed board assemblies - Part 7: Technical cleanliness of components and printed board assemblies
Standard published on 11.3.2020
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IEC/TR 61191-8-ed.1.0
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Printed board assemblies - Part 8: Voiding in solder joints of printed board assemblies for use in automotive electronic control units - Best practices
Standard published on 19.3.2021
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IEC/TR 61191-9-ed.1.0
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Printed board assemblies - Part 9: Electrochemical reliability and ionic contamination on printed circuit board assemblies for use in automotive applications - Best practices
Standard published on 7.6.2023
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