Standards IEC - International electro-technical commission - Page 576

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-504: General test methods for materials and assemblies - Process ionic contamination testing (PICT)
(Methodes d’essai pour les materiaux electriques, les cartes imprimees et autres structures d’interconnexion et ensembles - Partie 5-504: Methodes d’essai generales pour les materiaux et les ensembles - Essai de contamination ionique des procedes (PICT))

Standard published on 21.4.2020

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-506: General test methods for materials and assemblies - An intercomparison evaluation to implement the use of fine-pitch test structures for surface insulation resistance (SIR) testing of solder fluxes in accordance with IEC 61189-5-501

Standard published on 26.6.2019

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-601: General test methods for materials and assemblies - Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards
(Methodes d’essai pour les materiaux electriques, les cartes imprimees et autres structures d’interconnexion et ensembles - Partie 5-601: Methodes d’essai generales pour les materiaux et les assemblages - Essai d’aptitude au brasage par refusion pour un joint brase, et essai de resistance a la chaleur de refusion pour les cartes imprimees)

Standard published on 3.2.2021

Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly
(Materiaux de fixation pour les assemblages electroniques - Partie 1-1: Exigences relatives aux flux de brasage pour les interconnexions de haute qualite dans les assemblages de composants electroniques)

Standard published on 25.3.2002

Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
(Materiaux de fixation pour les assemblages electroniques - Partie 1-2: Exigences relatives aux pates a braser pour les interconnexions de haute qualite dans les assemblages de composants electroniques)

Standard published on 19.2.2014

Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications
(Materiaux de fixation pour les assemblages electroniques - Partie 1-3: Exigences relatives aux alliages a braser de categorie electronique et brasure solide fluxee et non-fluxee pour les applications de brasage electronique)

Standard published on 13.12.2017

Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
(Ensembles de cartes imprimees - Partie 1: Specification generique - Exigences relatives aux ensembles electriques et electroniques brases utilisant les techniques de montage en surface et associees)

Standard published on 14.9.2018

Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies

Standard published on 14.9.2018

Printed board assemblies - Part 10: Application and utilization of protective coatings for electronic assemblies

Standard published on 18.7.2022

Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
(Ensembles de cartes imprimees - Partie 2: Specification intermediaire - Exigences relatives a l´assemblage par brasage pour montage en surface)

Standard published on 23.5.2017