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Standards IEC - International electro-technical commission - Page 737
IEC – The company IEC is world-leading organization, which creates and issues International standards for all electrical, electronic and other related technologies known generally as electro-technologies. Wherever, there is electricity and electronics you can find the company IEC, which promotes the safety and performance, the environment, electrical energy efficiency and renewable energy. The company IEC also administers conformity assessment systems, which certify that the equipment, systems or components comply with International Standards of this company.
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IEC 61834-8-ed.1.0
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Recording - Helical-scan digital video cassette recording system using 6,35 mm magnetic tape for consumer use (525-60, 625-50, 1125-60 and 1250-50 systems) - Part 8: PALplus format for the 625-50 system
(Enregistrement - Systeme de magnetoscope numerique a cassette a balayage helicoidal utilisant la bande magnetique de 6,35 mm, destine au grand public (systemes 525-60, 625-50, 1125-60 et 1250-50) - Partie 8: Format PALplus pour le systeme 625-50)
Standard published on 27.6.2001
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IEC 61834-9-ed.1.0
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Recording - Helical-scan digital video cassette recording system using 6,35 mm magnetic tape for consumer use (525-60, 625-50, 1125-60 and 1250-50 systems) - Part 9: DVB format
(Enregistrement - Systeme de magnetoscope numerique a cassette a balayage helicoidal utilisant la bande magnetique de 6,35 mm destine au grand public (systemes 525-60, 625-50, 1125-60 et 1250-50) - Partie 9: Format DVB)
Standard published on 22.3.2001
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IEC 61835-ed.1.0
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Helical-scan digital component video cassette recording system using 12,65 mm (0,5 in) magnetic tape - Format D-5
(Systeme de magnetoscope numerique a componsante a balayage helicoidal sur bande magnetique de 12,65 mm (0,5 in) - Format D-5)
Standard published on 24.7.1998
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IEC/TS 61836-ed.4.0
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Solar photovoltaic energy systems - Terms, definitions and symbols
Standard published on 24.11.2025
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IEC 61837-1-ed.2.0
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Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 1: Plastic moulded enclosure outlines
(Dispositifs piezoelectriques a montage en surface pour la commande et le choix de la frequence - Encombrements normalises et connexions des sorties - Partie 1: Encombrements des enveloppes en plastique moulees)
Standard published on 20.4.2012
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IEC 61837-2-ed.3.0
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Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 2: Ceramic enclosures
(Dispositifs piezoelectriques a montage en surface pour la commande et le choix de la frequence - Encombrements normalises et connexions des sorties - Partie 2: Enveloppes en ceramique)
Standard published on 8.5.2018
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IEC 61837-2-ed.3.0/Amd.1
Change
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Amendment 1 - Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 2: Ceramic enclosures
(Amendement 1 - Dispositifs piezoelectriques a montage en surface pour la commande et le choix de la frequence - Encombrements normalises et connexions des sorties - Partie 2: Enveloppes en ceramique)
Change published on 24.9.2020
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IEC 61837-2-ed.3.1+Amd.1-CSV
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Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 2: Ceramic enclosures
(Dispositifs piezoelectriques a montage en surface pour la commande et le choix de la frequence - Encombrements normalises et connexions des sorties - Partie 2: Enveloppes en ceramique)
Standard published on 24.9.2020
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IEC 61837-3-ed.2.0
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Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 3: Metal enclosures
(Dispositifs piezoelectriques a montage en surface pour la commande et le choix de la frequence - Encombrements normalises et connexions des sorties - Partie 3: Enveloppes metalliques)
Standard published on 15.4.2015
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IEC 61837-4-ed.2.0
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Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 4: Hybrid enclosure outlines
(Dispositifs piezoelectriques a montage en surface pour la commande et le choix de la frequence - Encombrements normalises et connexions des sorties - Partie 4: Encombrements des enveloppes hybrides)
Standard published on 27.3.2015
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