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Standards IEC - International electro-technical commission - Page 796
IEC – The company IEC is world-leading organization, which creates and issues International standards for all electrical, electronic and other related technologies known generally as electro-technologies. Wherever, there is electricity and electronics you can find the company IEC, which promotes the safety and performance, the environment, electrical energy efficiency and renewable energy. The company IEC also administers conformity assessment systems, which certify that the equipment, systems or components comply with International Standards of this company.
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IEC 62047-5-ed.1.0/Cor.1
Correction
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Corrigendum 1 - Semiconductor devices - Micro-electromechanical devices - Part 5: RF MEMS switches
(Corrigendum 1 - Dispositifs a semiconducteurs - Dispositifs microelectromecaniques - Partie 5: Commutateurs MEMS-RF)
Correction published on 8.3.2012
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IEC 62047-50-ed.1.0
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Semiconductor devices - Micro-electromechanical devices - Part 50: MEMS capacitive microphones
Standard published on 29.4.2025
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IEC 62047-53-ed.1.0
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Semiconductor devices - Micro-electromechanical devices - Part 53: MEMS electrothermal transfer device
Standard published on 2.10.2025
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IEC 62047-6-ed.1.0
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Semiconductor devices - Micro-electromechanical devices - Part 6: Axial fatigue testing methods of thin film materials
(Dispositifs a semiconducteurs - Dispositifs microelectromecaniques - Partie 6: Methodes d´essais de fatigue axiale des materiaux en couche mince)
Standard published on 7.4.2009
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IEC 62047-7-ed.1.0
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Semiconductor devices - Micro-electromechanical devices - Part 7: MEMS BAW filter and duplexer for radio frequency control and selection
(Dispositifs a semiconducteurs - Dispositifs microelectromecaniques - Partie 7: Filtre et duplexeur BAW MEMS pour la commande et le choix des frequences radioelectriques)
Standard published on 16.6.2011
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IEC 62047-8-ed.1.0
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Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films
(Dispositifs a semiconducteurs - Dispositifs microelectromecaniques - Partie 8: Methode d´essai de la flexion de bandes en vue de la mesure des proprietes de traction des couches minces)
Standard published on 14.3.2011
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IEC 62047-9-ed.1.0
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Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS
(Dispositifs a semiconducteurs - Dispositif microelectromecaniques - Partie 9: Mesure de la resistance de collage de deux plaquettes pour les MEMS)
Standard published on 13.7.2011
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IEC 62047-9-ed.1.0/Cor.1
Correction
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Corrigendum 1 - Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS
(Corrigendum 1 - Dispositifs a semiconducteurs - Dispositifs microelectromecaniques - Partie 9: Mesure de la resistance de collage de deux plaquettes pour les MEMS)
Correction published on 8.3.2012
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IEC/TR 62048-ed.3.0
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Optical fibres - Reliability - Power law theory
Standard published on 22.1.2014
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IEC/TR 62051-1-ed.1.0
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Electricity metering - Data exchange for meter reading, tariff and load control - Glossary of terms - Part 1: Terms related to data exchange with metering equipment using DLMS/COSEM
Standard published on 12.1.2004
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