Printed boards and printed board assemblies. Design and use. Part 1-2. Generic requirements. Controlled impedance

Standard published on 1.3.2015

Printed boards and printed boards assemblies. Design and use. Part 5-1. Attachment (land/joint) considerations. Generic requirements

Standard published on 1.7.2013

Printed boards and printed board assemblies. Design and use. Part 5-2. Attachment (land/joint) considerations. Discrete components

Standard published on 1.3.2015

Printed boards and printed board assemblies. Design and use. Part 5-3. Attachment (land/joint) considerations. Components with gull-wing leads on two sides

Standard published on 1.3.2015

Printed boards and printed board assemblies. Design and use. Part 5-4. Attachment (land/joint) considerations. Components with J leads on two sides

Standard published on 1.3.2015

Printed boards and printed board assemblies. Design and use. Part 5-5. Attachment (land/joint) considerations. Components with gull-wing leads on four sides

Standard published on 1.3.2015

Printed boards and printed board assemblies. Design and use. Part 5-6. Attachment (land/joint) considerations. Chip carriers with J-leads on four sides

Standard published on 1.3.2015

Printed boards and printed board assemblies. Design and use. Part 5-8. Attachment (land/joint) considerations. Area array components (BGA, FBGA, CGA, LGA)

Standard published on 1.3.2015

Printed boards and printed boards assemblies. Design and use. Part 7. Electronic component zero orientation for CAD library construction

Standard published on 1.7.2018

Test methods for electrical materials, interconnection structures and assemblies. Part 1. General test methods and methodology

Standard published on 1.7.2013