Test methods for electrical materials, printed boards and other interconnection structures and assemblies. Part 2. Test methods for materials for interconnection structures

Standard published on 1.7.2013

Test methods for electrical materials, printed boards and other interconnection structures and assemblies. Part 3. Test methods for interconnection structures (printed boards)

Standard published on 1.3.2015

Test methods for electrical materials, printed boards and other interconnection structures and assemblies. Part 5-1. General test methods for materials and assemblies. Guidance for printed board assemblies

Standard published on 1.6.2020

Materials for electronic modules. Part 1-1. Requirements for soldering fluxes for high-quality interconnections in electronics assembly

Standard published on 1.7.2021

Printed board assemblies. Part 1. Surface mount and related assembly technologies. Generic specification

Standard published on 1.7.2018

Printed board assemblies. Part 2. Surface mount assemblies. Technical requirements

Standard published on 1.7.2018

Printed boards assemblies. Part 3. Sectional specification. Requirements for through-hole mount soldered assemblies

Standard published on 1.7.2011

Printed board assemblies. Part 3. Technical requirements. Through-hole mount soldered assemblies

Standard published on 1.6.2020

Printed boards assemblies. Part 4. Terminal mouting. Technical requirements

Standard published on 1.7.2011

Printed board assemblies. Part 4. Installation of contacts. Technical requirements

Standard published on 1.6.2020