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ASTM F1238-95(2011)
Standard Specification for Refractory Silicide Sputtering Targets for Microelectronic Applications (Withdrawn 2020)
Automatically translated name:
Standard Specification for Refractory Silicide Sputtering Targets for Microelectronic Applications
STANDARD published on 1.6.2011
The information about the standard:
Designation standards: ASTM F1238-95(2011)
Note: WITHDRAWN
Publication date standards: 1.6.2011
SKU: NS-49601
The number of pages: 3
Approximate weight : 9 g (0.02 lbs)
Country: American technical standard
Category: Technical standards ASTM
The category - similar standards:
Annotation of standard text ASTM F1238-95(2011) :
Keywords:
density, microelectronics, molybdenum disilicide, refractory silicides, sputtering, sputtering targets, tantalum disilicide, titanium disilicide, tungsten disilicide, Electrical conductors (semiconductors)--specifications, Electronic materials/applications--specifications, Metallic silicide, Molybdenum (electronic applications)--specifications, Polycaprolactone (PCL), Refractory silicide targets, Silicides, Tantalum (Ta)/tantalum alloys--specifications, Targets, Titanium silicide
Additional information
| 1. Scope |
|
1.1 This specification covers sputtering targets fabricated from metallic silicides (molybdenum silicide, tantalum silicide, titanium silicide, and tungsten silicide). These targets are referred to as refractory silicide targets, and are intended for use in microelectronic applications. 1.2 The values stated in SI units are to be regarded as standard. No other units of measurement are included in this standard. |
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