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  4. Standard "ASTM F638-88(1995)e1"
WITHDRAWN ASTM F638-88(1995)e1 1.1.2001 preview

Additional information

ASTM F638-88(1995)e1

Standard Specification for Fine Aluminum-1% Magnesium Wire for Semiconductor Lead-Bonding (Includes all amendments And changes 3/2/2021).

Automatically translated name:

Standard Specification for Fine Aluminum-1% Magnesium Wire for Semiconductor Lead-Bonding



STANDARD published on 1.1.2001


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77.00 USD

The information about the standard:

Designation standards: ASTM F638-88(1995)e1
Note: WITHDRAWN
Publication date standards: 1.1.2001
SKU: NS-55975
The number of pages: 3
Approximate weight : 9 g (0.02 lbs)
Country: American technical standard
Category: Technical standards ASTM

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Annotation of standard text ASTM F638-88(1995)e1 :

Keywords:

magnesium aluminum wire, wire bonding

Additional information

 
1. Scope

1.1 This specification covers aluminum-1% magnesium alloy wire for internal connections in semiconductor devices and is limited to wires of diameter up to and including 0.002 in. (0.051 mm). For diameters larger than 0.0020 in. (0.051 mm), the specifications are to be agreed upon between the purchaser and the supplier.

1.2 The values stated in inch-pound units are to be regarded as the standard. The values stated in parentheses are for information only.
 

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