We need your consent to use the individual data so that you can see information about your interests, among other things. Click "OK" to give your consent.
Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages.
STANDARD published on 1.9.2002
Designation standards: DIN EN 60191-6-2:2002-09
Publication date standards: 1.9.2002
SKU: NS-236838
The number of pages: 14
Approximate weight : 42 g (0.09 lbs)
Country: German technical standard
Category: Technical standards DIN
Electrical and electronics engineering drawingsMechanical structures for electronic equipment
Mechanische Normung von Halbleiterbauelementen - Teil 6-2: Allgemeine Regeln für die Erstellung von Gehäusezeichnungen von SMD-Halbleitergehäusen; Konstruktionsleitfaden für Gehäuse mit Kugel- und Säulenanschlüssen in einem Raster von 1,50 mm, 1,27 mm und 1,00 mm.
WITHDRAWN
1.8.2013
1.9.2011
1.8.2010
1.3.2011
1.3.2011
1.8.2013
Latest update: 2025-09-16 (Number of items: 2 234 278)
© Copyright 2025 NORMSERVIS s.r.o.