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Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for fine-pitch ball grid array (FBGA).
STANDARD published on 1.5.2002
Designation standards: DIN EN 60191-6-5:2002-05
Publication date standards: 1.5.2002
SKU: NS-236844
The number of pages: 11
Approximate weight : 33 g (0.07 lbs)
Country: German technical standard
Category: Technical standards DIN
Electrical and electronics engineering drawingsMechanical structures for electronic equipment
Mechanische Normung von Halbleiterbauelementen - Teil 6-5: Allgemeine Regeln für die Erstellung von Gehäusezeichnungen von SMD-Halbleitergehäusen; Konstruktionsleitfaden für Feinraster-Ball-Grid-Arrays (FBGA).
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Latest update: 2025-05-05 (Number of items: 2 198 283)
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