We need your consent to use the individual data so that you can see information about your interests, among other things. Click "OK" to give your consent.
Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat.
STANDARD published on 1.10.2009
Designation standards: DIN EN 60749-20-1:2009-10
Publication date standards: 1.10.2009
SKU: NS-237805
The number of pages: 39
Approximate weight : 117 g (0.26 lbs)
Country: German technical standard
Category: Technical standards DIN
Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 20-1: Handhabung, Verpackung, Kennzeichnung und Transport oberflächenmontierbarer Bauelemente, die empfindlich gegen die Kombination von Feuchte und Lötwärme sind.
1.2.2012
1.12.2003
WITHDRAWN
1.4.2003
WITHDRAWN
1.10.2006
WITHDRAWN
1.5.2014
1.3.2012
Do you want to make sure you use only the valid technical standards?
We can offer you a solution which will provide you a monthly overview concerning the updating of standards which you use.
Would you like to know more? Look at this page.
Latest update: 2024-04-23 (Number of items: 2 895 375)
© Copyright 2024 NORMSERVIS s.r.o.