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Standard DIN EN 60749-22:2003-12 1.12.2003 preview

DIN EN 60749-22:2003-12

Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength.



STANDARD published on 1.12.2003


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The information about the standard:

Designation standards: DIN EN 60749-22:2003-12
Publication date standards: 1.12.2003
SKU: NS-237810
The number of pages: 20
Approximate weight : 60 g (0.13 lbs)
Country: German technical standard
Category: Technical standards DIN

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The category - similar standards:

Semiconductor devices in general

Annotation of standard text DIN EN 60749-22:2003-12 :

Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 22: Kontaktfestigkeit (Bond-Strength).

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Latest update: 2025-09-12 (Number of items: 2 232 097)
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