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Semiconductor devices - Metallization stress void test.
STANDARD published on 1.12.2010
Designation standards: DIN EN 62418:2010-12
Publication date standards: 1.12.2010
SKU: NS-239836
The number of pages: 19
Approximate weight : 57 g (0.13 lbs)
Country: German technical standard
Category: Technical standards DIN
Halbleiterbauelemente - Prüfverfahren zur Metallisierungs-Stressmigration.
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1.11.2003
Latest update: 2025-06-15 (Number of items: 2 204 137)
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