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WITHDRAWN E DIN IEC 60191-6-5:2010-01 1.1.2010 preview

E DIN IEC 60191-6-5:2010-01 (Draft)

Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA).



STANDARD published on 1.1.2010


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The information about the standard:

Designation standards: E DIN IEC 60191-6-5:2010-01
Note: WITHDRAWN
Publication date standards: 1.1.2010
SKU: NS-302601
The number of pages: 38
Approximate weight : 114 g (0.25 lbs)
Country: German technical standard (Draft)
Category: Technical standards DIN

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Annotation of standard text E DIN IEC 60191-6-5:2010-01 :

Mechanische Normung von Halbleiterbauelementen - Teil 6-5: Allgemeine Regeln für die Erstellung von Gehäusezeichnungen von SMD-Halbleitergehäusen - Konstruktionsleitfaden für Feinraster-Ball-Grid-Arrays (FBGA).

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