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Standard IEC 60749-16-ed.1.0 17.1.2003 preview

IEC 60749-16-ed.1.0

Semiconductor devices - Mechanical and climatic test methods - Part 16: Particle impact noise detection (PIND)



STANDARD published on 17.1.2003


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The information about the standard:

Designation standards: IEC 60749-16-ed.1.0
Publication date standards: 17.1.2003
SKU: NS-411373
The number of pages: 13
Approximate weight : 39 g (0.09 lbs)
Country: International technical standard
Category: Technical standards IEC

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Semiconductor devices in general

Annotation of standard text IEC 60749-16-ed.1.0 :

Defines a test aiming at detecting the presence of loose particles inside a cavity device such as, for example, chips of ceramic, pieces of bonding wire or solder balls (prills). Definit un essai permettant de detecter la presence de particules libres a linterieur dun dispositif a cavite, comme des particules de ceramique, des elements de fil de liaison ou des boules de brasure (granules).

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Latest update: 2026-03-16 (Number of items: 2 266 785)
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