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IEC 60749-19-ed.1.0
Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength
STANDARD published on 13.2.2003
The information about the standard:
Designation standards: IEC 60749-19-ed.1.0
Publication date standards: 13.2.2003
SKU: NS-411376
The number of pages: 11
Approximate weight : 33 g (0.07 lbs)
Country: International technical standard
Category: Technical standards IEC
The category - similar standards:
Annotation of standard text IEC 60749-19-ed.1.0 :
Determines the integrity of materials and procedures used to attach semiconductor die to package headers or other substrates. Generally only applicable to cavity packages or as a process monitor. Determine la coherence des materiaux et des methodes dessai utilisees pour fixer les pastilles a semiconducteurs aux embases de boitiers ou autres substrats. Generalement applicable aux seuls boitiers a cavite ou comme moniteur de processus.
These changes apply to this standard:
IEC 60749-19-ed.1.0/Amd.1
Change
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Amendment 1 - Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength
(Amendement 1 - Dispositifs a semiconducteurs - Methodes d´essais mecaniques et climatiques - Partie 19: Resistance de la pastille au cisaillement)
Change published on 28.7.2010
Selected format:Show all technical information.
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