IEC 60749-19-ed.1.0/Amd.1

Amendment 1 - Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength

STANDARD published on 28.7.2010

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The information about the standard:

Designation standards: IEC 60749-19-ed.1.0/Amd.1
Note: Change
Publication date standards: 28.7.2010
SKU: NS-620066
The number of pages: 4
Approximate weight : 12 g (0.03 lbs)
Country: International technical standard
Category: Technical standards IEC

The category - similar standards:

Semiconductor devices in general

This change (correction) applies to this standard:

IEC 60749-19-ed.1.0

Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength
(Dispositifs a semiconducteurs - Methodes d´essais mecaniques et climatiques - Partie 19: Resistance de la pastille au cisaillement)

Standard published on 13.2.2003

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