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IEC 60749-19-ed.1.0/Amd.1
Amendment 1 - Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength
STANDARD published on 28.7.2010
The information about the standard:
Designation standards: IEC 60749-19-ed.1.0/Amd.1
Note: Change
Publication date standards: 28.7.2010
SKU: NS-620066
The number of pages: 4
Approximate weight : 12 g (0.03 lbs)
Country: International technical standard
Category: Technical standards IEC
The category - similar standards:
This change (correction) applies to this standard:
IEC 60749-19-ed.1.0
Show all technical information.
Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength
(Dispositifs a semiconducteurs - Methodes d´essais mecaniques et climatiques - Partie 19: Resistance de la pastille au cisaillement)
Standard published on 13.2.2003
Selected format:Show all technical information.
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