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IEC 60749-2-ed.1.0
Semiconductor devices - Mechanical and climatic test methods - Part 2: Low air pressure
STANDARD published on 12.4.2002
The information about the standard:
Designation standards: IEC 60749-2-ed.1.0
Publication date standards: 12.4.2002
SKU: NS-411380
The number of pages: 11
Approximate weight : 33 g (0.07 lbs)
Country: International technical standard
Category: Technical standards IEC
The category - similar standards:
Annotation of standard text IEC 60749-2-ed.1.0 :
Covers the testing of low air pressure on semiconductor devices. The test is intended primarily to determine the ability of component parts and materials to avoid voltage breakdown failures due to the reduced dielectric strength of air and other insulating materials at reduced pressures is only applicable to devices where the operating voltage exceeds 1 000 V. This test is applicable to all semiconductor devices provided they are in cavity type packages. The test is intended for military and space-related applications only. The contents of the corrigendum of August 2003 have been included in this copy. Decrit lessai de basse pression atmospherique applique aux dispositifs a semiconducteurs. Lessai est essentiellement destine a determiner la capacite des elements et des materiaux des composants a eviter les claquages provoques par la rigidite dielectrique amoindrie de lair et des autres materiaux isolants a des pressions reduites nest applicable quaux dispositifs dont la tension de fonctionnement depasse 1 000 V. Cet essai est applicable a tous les dispositifs a semiconducteurs qui sont installes dans des boitiers pourvus de cavites internes. Cet essai est uniquement destine aux applications militaires et spatiales. Le contenu du corrigendum daout 2003 a ete pris en consideration dans cet exemplaire.
These corrections apply to this standard:
IEC 60749-2-ed.1.0/Cor.1
Correction
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Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 2: Low air pressure
(Corrigendum 1 - Dispositifs a semiconducteurs - Methodes d´essais mecaniques et climatiques - Partie 2: Basse pression atmospherique)
Correction published on 12.8.2003
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