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IEC 62047-10-ed.1.0
Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials
STANDARD published on 26.7.2011
The information about the standard:
Designation standards: IEC 62047-10-ed.1.0
Publication date standards: 26.7.2011
SKU: NS-414098
The number of pages: 22
Approximate weight : 66 g (0.15 lbs)
Country: International technical standard
Category: Technical standards IEC
The category - similar standards:
Annotation of standard text IEC 62047-10-ed.1.0 :
IEC 62047-10:2011 specifies micro-pillar compression test method to measure compressive properties of MEMS materials with high accuracy, repeatability, and moderate effort of specimen fabrication. The uniaxial compressive stress-strain relationship of a specimen is measured, and the compressive modulus of elasticity and yield strength can be obtained. This standard is applicable to metallic, ceramic, and polymeric materials. The contents of the corrigendum of February 2012 have been included in this copy. La CEI 62047-10:2011 specifie une methode dessai de compression utilisant la technique des micro-piliers destinee a mesurer les proprietes de compression des materiaux des MEMS avec une precision et une repetabilite elevees et un effort modere pour la fabrication des eprouvettes. La relation contrainte-deformation de compression uniaxiale dune eprouvette est mesuree ce qui permet ainsi dobtenir le module de compression et la limite delasticite. La presente norme est applicable aux materiaux metalliques, ceramiques, et en polymeres. Le contenu du corrigendum de fevrier 2012 a ete pris en consideration dans cet exemplaire.
These corrections apply to this standard:
IEC 62047-10-ed.1.0/Cor.1
Correction
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Corrigendum 1 - Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials
(Corrigendum 1 - Dispositifs a semiconducteurs - Dispositifs microelectromecaniques - Partie 10: Essai de compression utilisant la technique des micro-piliers pour les materiaux des MEMS)
Correction published on 28.2.2012
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