Mechanical standardization of semiconductor devices—Part 4: Coding system and classification into forms of package outlines for semiconductor device packages

Standard published on 30.8.2019

Mechanical standardization of semiconductor devices—Part 5: Recommendations applying to tape automated bonding(TAB) of integrated circuits

Standard published on 17.9.2018

Mechanical standardization of semiconductor devices—Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages—Measuring methods for package dimensions of quad flat packs (QFP)
Execute Date: february 2027

Standard published on 30.7.2026

Mechanical standardization of semiconductor devices—Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages—Measuring methods for package dimensions of ball grid array (BGA)

Standard published on 23.5.2023

Mechanical standardization of semiconductor devices—Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages—Design guidelines for fine-pitch land grid array (FLGA)

Standard published on 31.12.2025

Mechanical standardization of semiconductor devices—Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA)
Execute Date: march 2027

Standard published on 28.8.2026

Mechanical standardization of semiconductor devices—Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA
Execute Date: march 2027

Standard published on 28.8.2026

Mechanical standardization of semiconductor devices—Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages—Design guide for ball grid array (BGA)
Execute Date: february 2027

Standard published on 30.7.2026

Mechanical standardization of semiconductor devices—Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages—Measuring methods for package dimensions of small outline J-lead packages SOJ
Execute Date: february 2027

Standard published on 30.7.2026

Medical glass thermometer

Standard published on 29.4.2024