Standards GB - Chinese national standards - Page 4733

Semiconductor devices—Mechanical and climatic test methods—Part 22: Bond strength

Standard published on 17.9.2018

Semiconductor devices—Mechanical and climatic test methods—Part 23:High temperature operating life

Standard published on 23.5.2023

Semiconductor devices—Mechanical and climatic test methods—Part 24: Accelerated moisture resistance—Unbiased HAST

Standard published on 2.12.2025

Semiconductor devices—Mechanical and climatic test methods—Part 25: Temperature cycling

Standard published on 2.12.2025

Semiconductor devices—Mechanical and climatic test methods—Part 26: Electrostatic discharge (ESD) sensitivity testing—Human body modelHBM

Standard published on 7.9.2023

Semiconductor devices—Mechanical and climatic test methods—Part 27: Electrostatic discharge(ESD) sensitivity testing—Machine model(MM)

Standard published on 23.5.2023

Semiconductor devices—Mechanical and climate test methods—Part 28: Electrostatic discharge (ESD) sensitivity testing—Charged device model (CDM)—device level
Execute Date: september 2026

Standard published on 27.2.2026

Semiconductor devices—Mechanical and climatic test methods—Part 29: Latch-up test

Standard published on 2.12.2025

Semiconductor devices - Mechanical and climatic tests methods - Part 3: External visual examination

Standard published on 5.11.2012

Semiconductor devices—Mechanical and climatic test methods—Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing

Standard published on 17.9.2018