Standards GB - Chinese national standards - Page 4732

Semiconductor devices—Mechanical and climatic test methods—Part 15: Resistance to soldering temperature for through-hole mounted devices

Standard published on 17.9.2018

Semiconductor devices—Mechanical and climatic test methods—Part 16: Particle impact noise detection(PIND)

Standard published on 31.10.2025

Semiconductor devices—Mechanical and climatic test methods—Part 17: Neutron irradiation

Standard published on 17.9.2018

Semiconductor devices—Mechanical and climatic test methods—Part 18:Ionizing radiation(total dose)

Standard published on 17.9.2018

Semiconductor devices—Mechanical and climatic test methods—Part 19:Die shear strength

Standard published on 17.9.2018

Semiconductor devicesMechanical and climatic test methodsPart 2: Low air pressure

Standard published on 23.8.2006

Semiconductor devices—Mechanical and climatic test methods—Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat

Standard published on 17.9.2018

Semiconductor devices—Mechanical and climatic test methods—Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat

Standard published on 17.9.2018

Semiconductor devices—Mechanical and climatic test methods—Part 20-1:Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat
Execute Date: november 2026

Standard published on 30.4.2026

Semiconductor devices—Mechanical and climatic test methods—Part 21: Solderability

Standard published on 17.9.2018