Standards GB - Chinese national standards - Page 4734

Semiconductor devices—Mechanical and climatic test methods—Part 31:Flammability of platic-encapsulated devicesinternally induced

Standard published on 23.5.2023

Semiconductor devices—Mechanical and climatic test methods—Part 32:Flammability of platic-encapsulated devicesexternally induced

Standard published on 23.5.2023

Semiconductor devices—Mechanical and climatic test methods—Part 33: Accelerated moisture resistance—Unbiased autoclave

Standard published on 2.12.2025

Semiconductor devices—Mechanical and climatic test methods—Part 34:Power cycling

Standard published on 15.3.2024

Semiconductor devices—Mechanical and climatic test methods—Part 35: Acoustic microscopy for plastic encapsulated electronic components

Standard published on 15.3.2024

Semiconductor devices—Mechanical and climatic test methods—Part 36:Accelerationsteady state

Standard published on 2.12.2025

Semiconductor devices—Mechanical and climatic test methods—Part 37: Board level drop test method using an accelerometer

Standard published on 31.12.2025

Semiconductor devices—Mechanical and climatic test methods—Part 38: Soft error test method for semiconductor devices with memory

Standard published on 2.12.2025

Semiconductor devices—Mechanical and climatic test methods—Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components

Standard published on 31.12.2025

Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST)

Standard published on 5.11.2012