Standards GB - Chinese national standards - Page 4893

Semiconductor devices—Mechanical and climatic test methods—Part 29: Latch-up test

Standard published on 2.12.2025

Semiconductor devices - Mechanical and climatic tests methods - Part 3: External visual examination

Standard published on 5.11.2012

Semiconductor devices—Mechanical and climatic test methods—Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing

Standard published on 17.9.2018

Semiconductor devices—Mechanical and climatic test methods—Part 31:Flammability of platic-encapsulated devicesinternally induced

Standard published on 23.5.2023

Semiconductor devices—Mechanical and climatic test methods—Part 32:Flammability of platic-encapsulated devicesexternally induced

Standard published on 23.5.2023

Semiconductor devices—Mechanical and climatic test methods—Part 33: Accelerated moisture resistance—Unbiased autoclave

Standard published on 2.12.2025

Semiconductor devices—Mechanical and climatic test methods—Part 34:Power cycling

Standard published on 15.3.2024

Semiconductor devices—Mechanical and climatic test methods—Part 35: Acoustic microscopy for plastic encapsulated electronic components

Standard published on 15.3.2024

Semiconductor devices—Mechanical and climatic test methods—Part 36:Accelerationsteady state

Standard published on 2.12.2025

Semiconductor devices—Mechanical and climatic test methods—Part 37: Board level drop test method using an accelerometer

Standard published on 31.12.2025