Standards GB - Chinese national standards - Page 4894

Semiconductor devices—Mechanical and climatic test methods—Part 38: Soft error test method for semiconductor devices with memory

Standard published on 2.12.2025

Semiconductor devices—Mechanical and climatic test methods—Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components

Standard published on 31.12.2025

Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST)

Standard published on 5.11.2012

-

Standard published on 5.11.2012

Semiconductor devices—Mechanical and climatic test methods—Part 40: Board level drop test method using a strain gauge

Standard published on 31.12.2025

Semiconductor devices—Mechanical and climatic test methods—Part 41Test method for reliability of non-volatile memory devices
Execute Date: september 2026

Standard published on 27.2.2026

Semiconductor devices—Mechanical and climatic test methods—Part 42:Temperature and humidity storage

Standard published on 23.5.2023

Semiconductor devices—Mechanical and climatic test methods—Part 44: Neutron beam irradiated single event effect (SEE) test method for semiconductor devices

Standard published on 2.12.2025

Semiconductor devices—Mechanical and climatic test methods—Part 8Sealing

Standard published on 31.12.2025

Semiconductor devices—Mechanical and climatic test methods—Part 9Permanence of marking
Execute Date: september 2026

Standard published on 27.2.2026