GB - Chinese national standards - Page 594

Standards GB - Chinese national standards - Page 594

Standards GB are Chinese national standards, which are issued by China's Standardization Administration Office (SAC).
Chinese national standards are used all over China commonly labeled as GB standards. They determine the united production requirements regarding product safety and quality .
GB standards are often modified or created according to the international standards of ISO, IEC or any other international level. Although, they are largely harmonized, GB standards may differ from international standards .
Approximately 15% of all GB standards are obligatory and they can be identified according to the prefix GB, after which the code of the standards follows:
GB – Obligatory national standards
GB/T – Optional national standards
GB/Z – National steering technical document

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GB/T 15878-2015

Semiconductor integrated circuits—Specification of leadframes for small outline package

Standard published on 15.5.2015

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406.80 USD


in 3 working days
GB/T 15879.4-2019

Mechanical standardization of semiconductor devices—Part 4: Coding system and classification into forms of package outlines for semiconductor device packages

Standard published on 30.8.2019

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412.80 USD


in 4 working days
GB/T 15879.5-2018

Mechanical standardization of semiconductor devices—Part 5: Recommendations applying to tape automated bonding(TAB) of integrated circuits

Standard published on 17.9.2018

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910.80 USD


in 4 working days
GB/T 15879.603-2026

Mechanical standardization of semiconductor devices—Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages—Measuring methods for package dimensions of quad flat packs (QFP)
Execute Date: february 2027

Standard published on 30.7.2026

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ON REQUEST


Out of stock
GB/T 15879.604-2023

Mechanical standardization of semiconductor devices—Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages—Measuring methods for package dimensions of ball grid array (BGA)

Standard published on 23.5.2023

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424.80 USD


in 4 working days
GB/T 15879.612-2025

Mechanical standardization of semiconductor devices—Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages—Design guidelines for fine-pitch land grid array (FLGA)

Standard published on 31.12.2025

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736.80 USD


in 5 working days
GB/T 15879.618-2026

Mechanical standardization of semiconductor devices—Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages—Design guide for ball grid array (BGA)
Execute Date: february 2027

Standard published on 30.7.2026

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ON REQUEST


Out of stock
GB/T 15879.620-2026

Mechanical standardization of semiconductor devices—Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages—Measuring methods for package dimensions of small outline J-lead packages SOJ
Execute Date: february 2027

Standard published on 30.7.2026

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GB 1588-2024

Medical glass thermometer

Standard published on 29.4.2024

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430.80 USD


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GB/T 15880-1995

Potentiometers for use in electronic equipment--Part 3:Sectional specification--Rotary precision potentiometers

Standard published on 22.12.1995

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838.80 USD


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