Electrical and electronic measuring equipment - Documentation
(Equipement de mesures electriques et electroniques - Documentation)

Standard published on 30.11.1993

Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components
(Cartes imprimees et cartes imprimees equipees - Conception et utilisation - Partie 5-2: Considerations sur les liaisons pistes-soudures - Composants discrets)

Standard published on 24.6.2003

Printed boards and printed board assemblies - Design and use - Part 5-3: Attachment (land/joint) considerations - Components with gull-wing leads on two sides
(Cartes imprimees et cartes imprimees equipees - Conception et utilisation - Partie 5-3: Considerations sur les liaisons pistes-soudures - Composants a sorties en aile de mouette sur deux cotes)

Standard published on 30.10.2007

Printed boards and printed board assemblies - Design and use - Part 5-4: Attachment (land/joint) considerations - Components with J leads on two sides
(Cartes imprimees et cartes imprimees equipees - Conception et utilisation - Partie 5-4: Considerations sur les liaisons pistes-soudures - Composants a sorties en J sur deux cotes)

Standard published on 30.10.2007

Printed boards and printed board assemblies - Design and use - Part 5-5: Attachment (land/joint) considerations - Components with gull-wing leads on four sides
(Cartes imprimees et cartes imprimees equipees - Conception et utilisation - Partie 5-5: Considerations sur les liaisons pistes-soudures - Composants a sorties en aile de mouette sur quatre cotes)

Standard published on 30.10.2007

Printed boards and printed board assemblies - Design and use - Part 5-6: Attachment (land/joint) considerations - Chip carriers with J-leads on four sides
(Cartes imprimees et cartes imprimees equipees - Conception et utilisation - Partie 5-6: Considerations sur les liaisons pistes-soudures - Composants a sorties en J sur quatre cotes)

Standard published on 23.1.2003

Printed board and printed board assemblies - Design and use - Part 5-8: Attachment (land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA)
(Cartes imprimees et cartes imprimees equipees - Conception et utilisation - Partie 5-8: Considerations sur les liaisons pastilles/joints - Composants matriciels (BGA, FBGA, CGA, LGA))

Standard published on 30.10.2007

Circuit boards and circuit board assemblies - Design and use - Part 6-1: Land pattern design - Generic requirements for land pattern on circuit boards
(Cartes imprimees et cartes imprimees equipees - Conception et utilisation - Partie 6-1: Conception de la zone de report - Exigences generiques pour la zone de report sur les cartes imprimees)

Standard published on 23.2.2021

Circuit boards and circuit board assemblies - Design and use - Part 6-2: Land pattern design - Description of land pattern for the most common surface mounted components (SMD)
(Cartes imprimees et cartes imprimees equipees - Conception et utilisation - Partie 6-2: Conception de la zone de report - Description de la zone de report pour les composants montes en surface (CMS) les plus courants)

Standard published on 4.2.2021

Circuit boards and circuit board assemblies - Design and use - Part 6-3: Land pattern design - Description of land pattern for through hole components (THT)
(Cartes imprimees et cartes imprimees equipees - Conception et utilisation - Partie 6-3: Conception de la zone de report - Description de la zone de report pour les composants a trous traversants (THT))

Standard published on 9.12.2024