Cores made of soft magnetic materials - Measuring methods - Part 1: Generic specification
(Noyaux en materiaux magnetiques doux - Methodes de mesure - Partie 1: Specification generique)

Standard published on 28.5.2002

Cores made of soft magnetic materials - Measuring methods - Part 2: Magnetic properties at low excitation level
(Noyaux en materiaux magnetiques doux - Methodes de mesure - Partie 2: Proprietes magnetiques a niveau d´excitation faible)

Standard published on 7.3.2005

Corrigendum 1 - Cores made of soft magnetic materials - Measuring methods - Part 2: Magnetic properties at low excitation level
(Corrigendum 1 - Noyaux en materiaux magnetiques doux - Methodes de mesure - Partie 2: Proprietes magnetiques a niveau d´excitation faible)

Correction published on 26.5.2021

Cores made of soft magnetic materials - Measuring methods - Part 3: Magnetic properties at high excitation level
(Noyaux en materiaux magnetiques doux - Methodes de mesure - Partie 3: Proprietes magnetiques a niveau eleve d´excitation)

Standard published on 7.7.2023

Cores made of soft magnetic materials - Measuring methods - Part 3: Magnetic properties at high excitation level

Standard published on 7.7.2023

Multimedia security - Guideline for privacy protection of equipment and systems in and out of use - Part 1: General

Standard published on 13.12.2006

Safety of machinery - Application of protective equipment to detect the presence of persons
(Securite des machines - Application des equipements de protection a la detection de la presence de personnes)

Standard published on 28.7.2026

Semiconductor devices - Micro-electromechanical devices - Part 1: Terms and definitions
(Dispositifs a semiconducteurs - Dispositifs microelectromecaniques - Partie 1: Termes et definitions)

Standard published on 6.1.2016

Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials
(Dispositifs a semiconducteur - Dispositifs microelectromecaniques - Partie 10: Essai de compression utilisant la technique des micro-piliers pour les materiaux des MEMS)

Standard published on 26.7.2011

Corrigendum 1 - Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials
(Corrigendum 1 - Dispositifs a semiconducteurs - Dispositifs microelectromecaniques - Partie 10: Essai de compression utilisant la technique des micro-piliers pour les materiaux des MEMS)

Correction published on 28.2.2012