Corrigendum 1 - Semiconductor devices - Micro-electromechanical devices - Part 5: RF MEMS switches
(Corrigendum 1 - Dispositifs a semiconducteurs - Dispositifs microelectromecaniques - Partie 5: Commutateurs MEMS-RF)

Correction published on 8.3.2012

Semiconductor devices - Micro-electromechanical devices - Part 50: MEMS capacitive microphones

Standard published on 29.4.2025

Semiconductor devices - Micro-electromechanical devices - Part 52: Biaxial tensile testing method for stretchable MEMS

Standard published on 4.3.2026

Semiconductor devices - Micro-electromechanical devices - Part 53: MEMS electrothermal transfer device

Standard published on 2.10.2025

Semiconductor devices - Micro-electromechanical devices - Part 6: Axial fatigue testing methods of thin film materials
(Dispositifs a semiconducteurs - Dispositifs microelectromecaniques - Partie 6: Methodes d´essais de fatigue axiale des materiaux en couche mince)

Standard published on 7.4.2009

Semiconductor devices - Micro-electromechanical devices - Part 7: MEMS BAW filter and duplexer for radio frequency control and selection
(Dispositifs a semiconducteurs - Dispositifs microelectromecaniques - Partie 7: Filtre et duplexeur BAW MEMS pour la commande et le choix des frequences radioelectriques)

Standard published on 16.6.2011

Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films
(Dispositifs a semiconducteurs - Dispositifs microelectromecaniques - Partie 8: Methode d´essai de la flexion de bandes en vue de la mesure des proprietes de traction des couches minces)

Standard published on 14.3.2011

Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS
(Dispositifs a semiconducteurs - Dispositif microelectromecaniques - Partie 9: Mesure de la resistance de collage de deux plaquettes pour les MEMS)

Standard published on 13.7.2011

Corrigendum 1 - Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS
(Corrigendum 1 - Dispositifs a semiconducteurs - Dispositifs microelectromecaniques - Partie 9: Mesure de la resistance de collage de deux plaquettes pour les MEMS)

Correction published on 8.3.2012

Optical fibres - Reliability - Power law theory

Standard published on 22.1.2014